A sensitivity study is undertaken to characterize the impact of the trend of smaller feature sizes in emerging electronic packaging technologies on overall structural performance of the substrate under thermal and combined thermomechanical loading conditions. The study consists of both modeling and experimental efforts. Multiple local-global modeling approaches are employed within the framework of a finite element code to simulate performance of different design geometry combinations in known failure modes such as microvia cracking, buildup layer delaminations, and PTH cracking. In the simulations, the substrate is modeled using different effective property techniques and constitutive models to best capture composite behavior at the global level with more detailed constituent properties and geometries captured at the local level. Experiments are also conducted to better characterize time, temperature, and rate-dependant constitutive behavior of substrate materials for use in simulations and validation of predictive modeling capability. From this study, directions on future modeling approaches and geometric design guidelines are proposed.
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