Monday, 11 October 2004 - 10:55 AM

This presentation is part of : Recent Progress in Laser-assisted Micro/Nanoprocessing

Study of Transient Thermo-mechanical Phenomena in Micro-scale Laser Materials Processing with Embedded Micro Thin Film Sensors

Hongseok Choi and Xiaochun Li. Department of Mechanical Engineering, 1513 University Avenue, University of Wisconsin-Madison, Madison, WI 53706

The ability to sense the transient thermomechanical history accurately near laser-material interaction region inside the workpiece is essential for scientific understanding of laser material processing. Conventional sensors are not capable to provide adequate spatial and temporal resolution. It is of significance to explore the use of minimally intrusive and fast response micro thin film thermocouples (TFTCs) and strain gauges (TFSGs) for investigating the transient thermomechanical phenomena during micro laser processing. Arrays of these sensors are embedded in nickel and nickel-iron workpieces. These sensors are capable of providing transient thermo-mechanical sensing data in-situ during laser micro-machining and micro-joining. This study promises to dramatic improvements in the ability of sensing of the transient thermomechanical history in laser materials processing. The measured data can also serve as a benchmark for verifying the validity of numerous heat flow and thermal stress numerical and analytical models that have been traditionally used to study the micro laser materials processing.

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