Steam laser cleaning of nanoparticles from silicon substrates (student talk)

Wednesday, 13 October 2004 - 1:35 PM

This presentation is part of : Laser Materials Processing: Advanced Applications

Steam laser cleaning of nanoparticles from silicon substrates (student talk)

nagaraj Batta, University of Nebraska , lincoln , Department of Electrical Engineering, 209N Walter Scott Engineering Center, P.O. Box 880511, Lincoln, NE 68588-051 and Yongfeng Lu, University of Nebraska-Lincoln, 209N Walter Scott Engineering Center, P.O. Box 880511, Lincoln, NE 68588-0511.

Cleaning efficiency dependence on various material types of nanoparticles in steam laser cleaning of silicon substrates will be presented. Nanoparticles, including silica, alumina and titanium carbide were deposited on silicon substrates. A KrF excimer laser with a wavelength of 248 nm was used to irradiate the substrates in laser cleaning. A water steam layer of micrometer thickness was deposited on silicon substrates to improve the cleaning process. Cleaning efficiency was measured for different laser fluences ranging from 50 to 250 mJ/cm2 and pulse numbers from 1 to 500. Scanning electron micrographs of silicon samples before and after laser cleaning were used to calculate the cleaning efficiency. Ultrafast photodetector was used to monitor the water steam deposition and removal in the steam laser cleaning process

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