3-D hemispherical cavities, depicting multiple layer imprinting, were formed in the silicon substrate using silica particles, with a diameter of 1 um, deposited on a silicon substrate using self-assembly technique. Uniform multiple layers of silica particles were thus achieved using layer by layer assembly. A KrF excimer laser beam, with a wavelength of 248 nm and with a very high fluence of 1800 mJ /cm2, was vertically irradiated on the quartz plate placed on the silicon substrate containing multiple layers of silica particles, which was pre heated to 550oC. The quartz plate being transparent to the excimer laser, and the transient silicon surface melting during the laser pulse, imprints the silica particles into silicon substrates. The melted silicon fills in the gap between the layers of the silica covering the top layer. Ultrasonic cleaning and hydrofluoric-acid (HF) solution were then used to remove the silica particles. Thereby the multiple layer imprinting in silicon can be clearly viewed using SEM.
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