Monday, 11 October 2004 - 5:35 PM

This presentation is part of : Horgan Symposium

Thermal Behavior of an Elliptic Inhomogeneity Surrounded by a Compliant Interphase Layer

Stanislav Potapenko1, Hongnian Shen, and Peter Schiavone2. (1) Department of Civil Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON N2L3G1, Canada, (2) Department of Mechanical Engineering, University of Alberta, Edmonton, AB T6G2G8, Canada

In this presentation we examine the effects on internal thermal stresses of a compliant interphase layer surrounding an elliptic inhomogeneity which is embedded within an infinite matrix subjected to plane deformations. The interphase layer is modeled as a spring layer with vanishing thickness, thus allowing continuity of tractions but discontinuity of displacements across the layer. Theoretical predictions for the thermal stresses are obtained using complex variable methods and subsequently validated by solving the same analytical model using the finite element method. The latter is then used to examine four cases of practical interest, namely, in which the inhomogeneity is made up from either aluminium, copper, gold or silver and surrounded, in each case, by a silicon matrix, The results demonstrate the variation of the thermal stresses with the aspect ratio of the inhomogeneity and the parameters describing the properties of the interphase layer.

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